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July 20, 2019
August 8, 2019

Acceptance Notification

September 25, 2019

Early Bird Registration Deadline

 October 15, 2019

Postdeadline Paper

 October 16, 2019

Conference Date

November 11-14, 2019

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Supporting Journal

Workshop 03: More-than-Moore with Electronic-Photonic Co-Design

DATE: 9/26/2019

Workshop 03
More-than-Moore with Electronic-Photonic Co-Design


November 11, 2019 Wuhan, China

 

Organizers

Min Tan
Huazhong University of Science and Technology, China
Jiang Xu
The Hong Kong University of Science and Technology, China

With Moore's Law approaching to its end, the semiconductor industry starts to embrace the "More-than-Moore" concept that includes a diversity of new functionalities. Silicon photonics emerges as a promising option for this"More-than-Moore" concept. Just as integrating the inductor into CMOS platform in the late 1990s that enabled CMOS RF IC and created the mobile age, silicon photonics has the potential to revolutionize many new applications in the IoT and AI age. Nevertheless, silicon photonics faces challenges, such thermal sensitivity, on-chip laser, high efficiency coupling and so on. To solve these challenges, the co-design of photonics and microelectronics become essential.

Invited Speakers

Bing Bai, Beijing Jiaotong University, China

Title: Photonic-electronic heterogeneous processor for AI computing

Abstract: In this talk, we will introduce the crucial silicon-photonic devices and overarching design of the first commercialized photonic intelligent server LightC.
Jin Guo, Chongqing United MicroElectronics Center, China

Title: The More-than-Moore process platform for silicon photonics

Abstract: The open access platform of CUMEC for silicon photonics is introduced. Some initial experimental results are demonstrated. The vision and mission of CUMEC are presented as well.
Dan Li, Xi'an JiaoTong University, China

Title: Low-noise optical receiver design with photonics evolution: from III-V to SiPh

Abstract: In this talk, I will introduce examples of optical receiver design for both III-V and Si based photonics tailored to their device characteristics, where the photodiode capacitance plays a key role in low noise design.
Quan Pan, Southern University of Science and Technology, China

Title:Low-power CMOS optical communication ICs for emerging high-speed applications

Abstract: CMOS optoelectronic integrated circuits have become extremely attractive. Currently energy-efficient 100-GbE systems based on four channels of 25-Gb/s links requiring an optical receiver and a clock data recovery circuit with sophisticated equalization are implemented. Future 200/400-GbE PAM4 systems are also studied.
Nan Qi, Institute of Semiconductors, CAS, China

Title: Co-design of high-speed driver circuits with silicon photonic modulators

Abstract: We discuss the design challenges and techniques in CMOS laser and modulator drivers. Two practical designs are demonstrated, including a VCSEL driver and a Si-photonic MZM driver, both running at 50Gb/s integrated with PAM4 CDR.
Min Tan, Huazhong University of Science and Technology, China

Title: Electronic-photonic hybrid closed-loop control: challenges and solutions

Abstract: In this talk, we discuss the stability challenge of on-chip photonic parameters and reviews the recent progress on electronic-photonic hybrid feedback control techniques. We will focus on wavelength stabilization of microring resonators.
Xiaolong Wang, Oregon State University, USA

Title: High-speed atto-joule/bit silicon photonic crystal nanocavity modulators driven by transparent conductive oxide gates

Abstract: We will discuss recent progress of integrated silicon photonic devices driven by transparent conductive oxide gates, which achieve ultra-compact device footprint, extreme wavelength tunability, ultra-low energy consumption, and high modulation bandwidth for on-chip optical interconnects.
Xu Wang, Lumerical Inc., Canada

Title: Co-simulation of photonics and electronics

Abstract: We will discuss recent progress of integrated silicon photonic devices driven by transparent conductive oxide gates, which achieve ultra-compact device footprint, extreme wavelength tunability, ultra-low energy consumption, and high modulation bandwidth for on-chip optical interconnects.
Xi Xiao, China Information Communication Technologies Group Corporation, China

Title: Improving the interconnection capacity by silicon-based PIC and EPIC

Abstract: This talk will review our recent work on high baudrate silicon photonic transmitter operating at 53Gbaud to 100Gbaud.
Jiang Xu, The Hong Kong University of Science and Technology, China

Title: Rejuvenate Post-Moore's Law computing with photonics

Abstract: To enable co-simulation of photonic and electronic circuits, we have developed design flows that combine the maturity of EDA with the most advanced photonic modeling technologies.
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